The finished product assembly after pcba processing is completed. Let's break down the assembly process: 1. Prepare the materials, equipment and tools required for circuit board assembly ①One DC regulated power supply and one multimeter;

Today, Lexus will give you some knowledge about important materials for SMT chip processing. 1. SMT chip processing technology solder paste Solder paste is a paste made of alloy solder powder and paste flux evenly stirred. It is an indispens

在SMT貼片加工中直通率不斷是一個(gè)重要的參數(shù)。直通率就是產(chǎn)品從第一道工序開(kāi)端到最后一道工序完畢，主要的指標(biāo)有消費(fèi)質(zhì)量、工作質(zhì)量、測(cè)試質(zhì)量等。直通率與公司的工藝才能是一個(gè)正相關(guān)的比值，假如一個(gè)smt加工廠(chǎng)的直通率十分的高，也間接的證明了這個(gè)公司的質(zhì)量與技術(shù)實(shí)力。這也是我們不斷在內(nèi)部強(qiáng)調(diào)要關(guān)注直通率的緣由。 那么其實(shí)……

有些設(shè)計(jì)者選擇在pcba設(shè)計(jì)和制造后直接投入消費(fèi)，但這樣做并不明智。很多問(wèn)題都可能在消費(fèi)，裝配和測(cè)試的很多階段發(fā)作。因而，從少量的PCBA打樣開(kāi)端十分重要： 　　費(fèi)用——第一批PCBA打樣貼片能夠協(xié)助你找到減少線(xiàn)路板制造和裝配本錢(qián)的辦法；此外，大量消費(fèi)有缺陷的設(shè)計(jì)也會(huì)花掉一大筆錢(qián)。 ……

在PCBA打樣中，與玻璃纖維板相比，陶瓷基板容易破碎，對(duì)工藝要求更高。陶瓷基板打樣過(guò)程中有幾個(gè)非常重要的技術(shù)環(huán)節(jié)。讓雷卡仕來(lái)分享一下: 　　1.鉆孔 　　通常，陶瓷基板通過(guò)激光鉆孔。與傳統(tǒng)鉆孔技術(shù)相比，激光鉆孔技術(shù)具有精度高、速度快、效率高、可大規(guī)模批量鉆孔、適用于大多數(shù)軟硬材料、不損耗工具……

一般來(lái)說(shuō)，PCBA加工需要選擇無(wú)塵防靜電的車(chē)間，溫濕度有控制目標(biāo)，對(duì)切腳沒(méi)有要求。 　　對(duì)于貼片加工來(lái)說(shuō)，掌握焊接溫度非常重要。一般來(lái)說(shuō)，手工焊接溫度應(yīng)保持在240-280度的標(biāo)準(zhǔn)范圍內(nèi)，設(shè)定溫度與烙鐵溫度的差值應(yīng)盡可能小。 　　如果設(shè)備的焊接預(yù)熱區(qū)、保溫區(qū)、回流焊區(qū)、冷卻區(qū)不同，就要根據(jù)不……

Some novices in the electronics manufacturing industry may not be very clear about PCBA and PCB, but they may also be confused. When they are new to the electronics industry, they will also encounter such problems. In order for everyone to quickly identif

The smt patch was born with the development of the electronics industry, and developed with the development of computer application technology, electronic technology and information technology. SMT patch can develop rapidly due to its own advantages. The

What are the requirements for PCBA patch processing and SMT patch processing? Leicas believes that the following are the main points for reference: With the development of electronic products in the direction of miniaturization, the size of SMT co